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Description: This partnership combines Michigan's programs in sensors and microsystems with Michigan State's leadership in materials, especially in diamond and in carbon nanotubes, and Michigan Tech's capabilities in packaging, micromilling, and hot embossing. Funded by the National Science Foundation, with additional support from the three partnering core universities, other federal agencies, and a consortium of some twenty companies, the WIMS ERC has merged micropower circuits, wireless interfaces, MEMS, and advanced packaging to create microsystems. The website includes information about the center and its research as well as personnel and related educational programs.
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Subject: University of Michigan. College of Engineering., University of Michigan. Department of Electrical Engineering and Computer Science., University of Michigan -- Research.
Group: Engineering Research Center for Wireless Integrated Microsystems (University of Michigan)
Publisher: Wireless Integrated MicroSensing & Systems.
Corporate Creator: University of Michigan. Department of Electrical Engineering and Computer Science.
Description: This partnership combines Michigan's programs in sensors and microsystems with Michigan State's leadership in materials, especially in diamond and in carbon nanotubes, and Michigan Tech's capabilities in packaging, micromilling, and hot embossing. Funded by the National Science Foundation, with additional support from the three partnering core universities, other federal agencies, and a consortium of some twenty companies, the WIMS ERC has merged micropower circuits, wireless interfaces, MEMS, and advanced packaging to create microsystems. The website includes information about the center and its research as well as personnel and related educational programs.
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Subject: University of Michigan. College of Engineering., University of Michigan. Department of Electrical Engineering and Computer Science., University of Michigan -- Research.
Group: Engineering Research Center for Wireless Integrated Microsystems (University of Michigan)
Publisher: Wireless Integrated MicroSensing & Systems.
Corporate Creator: University of Michigan. Department of Electrical Engineering and Computer Science.
Description: This partnership combines Michigan's programs in sensors and microsystems with Michigan State's leadership in materials, especially in diamond and in carbon nanotubes, and Michigan Tech's capabilities in packaging, micromilling, and hot embossing. Funded by the National Science Foundation, with additional support from the three partnering core universities, other federal agencies, and a consortium of some twenty companies, the WIMS ERC has merged micropower circuits, wireless interfaces, MEMS, and advanced packaging to create microsystems. The website includes information about the center and its research as well as personnel and related educational programs.
Loading Wayback Capture Info...
Loading video data...
Subject: University of Michigan. College of Engineering., University of Michigan. Department of Electrical Engineering and Computer Science., University of Michigan -- Research.
Group: Engineering Research Center for Wireless Integrated Microsystems (University of Michigan)
Publisher: Wireless Integrated MicroSensing & Systems.
Corporate Creator: University of Michigan. Department of Electrical Engineering and Computer Science.
Page 1 of 1 (3 Total Results)
